Heat sink(CPU) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
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Heat sink Product List

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Fanless heatsink for Intel Socket LGA1700.

Fanless heatsink for Intel Socket LGA1700.

Total height 27mm, fanless heat sink cooler with copper core heat sink with heat pipe + aluminum fins.

It can cool CPUs for Intel Socket LGA1700. 【Features】 ● Fanless CPU cooler for Intel Socket LGA1700. ● A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used to efficiently transfer heat, allowing for quick dissipation of CPU heat. ● With a height of 27mm, it is slim and ideal for 1U rack mount cases, slim cases, and small cases where space is limited. ● This product is a fanless heatsink, so cooling performance is affected by the environment in which it is used. It is essential to direct airflow from an external source. Additionally, it does not guarantee cooling performance. ● The installation method uses a backplate, ensuring a secure fit and close contact with the CPU. There is also no worry of it falling, allowing for safe transportation.

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or where small fans are arranged, such as in 1U rack-mounted servers. A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used. The heat pipes efficiently transfer heat, allowing the CPU's heat to dissipate quickly.

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used in 2U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 2U rack-mounted servers with small fans arranged. It features a heatsink structure that combines a copper base with stacked aluminum fins. A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used. The heat pipes efficiently transfer heat, allowing for quick dissipation of the CPU's heat.

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[Case Study] Optimization of Heat Sink Shape

[Case Study] Optimization of Heat Sink Shape

We will introduce a case study on the optimization of heat sink shapes, which is important for CPU heat dissipation measures!

We would like to introduce a case study where the "modeFRONTIER" was applied to optimize the shape of a heat sink. As a countermeasure to the heat generation problem of CPUs used in computers and other devices, it is very important to optimize the heat dissipation performance of heat sinks. With the multi-purpose optimization of "modeFRONTIER," it is possible to explicitly present a lineup of heat sinks with high heat dissipation performance that are suitable for the diversifying product shapes as Pareto solutions. [Case Study] ■ Software Used: modeFRONTIER ■ Objective: Countermeasure for CPU heat generation in computers and other devices ■ Challenge: Optimize the heat dissipation performance of heat sinks ■ Result: By using multi-purpose optimization, a lineup of heat sinks with high heat dissipation performance suitable for diversifying product shapes was explicitly presented as Pareto solutions. *For more details, please refer to the external link or feel free to contact us.

  • Company：IDAJ
  • Price：Other
  • Scientific Calculation and Simulation Software
  • Analysis and prediction system

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As the performance of electronic devices continues to improve, components with higher heat dissipation capabilities are needed.

As the performance of electronic devices continues to improve, components with higher heat dissipation capabilities are needed.

Introducing examples of PIM utilization! We can mass-produce various shapes of heat dissipation products with excellent heat dissipation performance.

We would like to introduce a case study of PIM utilization by Atect Co., Ltd. As the CPU processing speeds of PCs and smartphones increase, the power generation has grown, necessitating high-precision components made from ceramic materials. Our company can manufacture excellent heat dissipation and insulation components using ceramics that have been thermally conductive through our unique technology, leveraging the high emissivity that ceramics inherently possess. These can be applied in various forms such as CPU heat sinks, fin-type heat sinks, pyramid-type heat sinks, pole-type heat sinks, and thin heat sinks. [Challenges Addressed] ■ Manufacturing of high-precision components using ceramic materials *For more details, please refer to the PDF document or feel free to contact us.

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. Mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, airflow must be directed at the heatsink from an external source. It is often used in environments such as 1U rack-mounted servers equipped with blower fans or lined with small fans. The heatsink is a monolithic structure machined from aluminum ingots (raw material state).

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink made from pure copper ingots (material in solid form) that has been machined (skyve processed) into a single molded shape.

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink made from aluminum ingots (in a solid material state) that have been machined (skyve processed) into a single piece.

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink structure with aluminum fins stacked and crimped onto an aluminum base bottom.

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or where small fans are arranged, such as in 1U rack-mounted servers. It features a heatsink structure with a copper base and stacked aluminum fins that are crimped and joined together.

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 2U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from the outside onto the heatsink. This product is often used in environments where blower fans are installed or in 2U rack-mounted servers with small fans arranged. The heatsink is a one-piece molded component made from machined aluminum ingots (material in block form).

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Copper water-cooled heat sink

Copper water-cooled heat sink

Immediate delivery is possible for in-stock items! We have a variety of standard products available, ranging from 20mm square to 1m in length, suitable for various applications.

We would like to introduce our copper water-cooled heat sinks. We offer a lineup including the "P-100S," suitable for CPUs and Peltier elements, as well as the "L-100S" and "R-1000T." We have standard products ranging from 20mm square to 1m in length to suit various applications. Since these are in stock, they can be delivered immediately, and we also sell peripheral equipment such as cooling water circulation systems. Additionally, we are open to inquiries about custom products. 【Features】 ■ Excellent cooling capacity ■ Standard products available from 20mm square to 1m in length for various applications ■ Immediate delivery possible due to stock availability ■ Peripheral equipment such as cooling water circulation systems also available ■ Custom product inquiries are welcome *For more details, please refer to the PDF document or feel free to contact us.

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Heat sink for surface mount devices, SQ series

Heat sink for surface mount devices, SQ series

The SQ series is an aluminum extrusion type with a slit fin type.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface mount devices are of the aluminum extrusion type and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.

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Heat sink, multipurpose, general-purpose F/H/M series

Heat sink, multipurpose, general-purpose F/H/M series

The F/H/M series is an aluminum extruded fin-type heat sink.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The multi-purpose, general-purpose F/H/M series heat sinks are aluminum extruded fin-type heat sinks. *Online meetings are also possible, so please feel free to contact us.

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